Hello Fellow Netters, Here's a recipe for a soldering nightmare. We're developing a process that involves the following materials, but not having very good success with attaining an 'acceptable' solder joint. Lap soldering a .4 mil dia platinum wire to the top of a .040" dia kovar post using indium solder (60% indium/40% lead). Additional info: the kovar post has a nickel coat 200 micro inches, then 30 micro inches of hard gold plating. One issue: indium solder does not wet to tip of iron and platinum wire (tip temp is at 670F) Second issue: If we use zinc chloride as a fluxing agent, the end solder is better, but we would rather stay away from using this flux (too corrosive). Does this challenge anyone out there? We'd appreciate any and all feedback. Process Control Supervisor [log in to unmask] Industrial Scientific Corp. www.indsci.com voice 412.490.1884 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------