If immersion tin does whisker, wouldn't exposed traces (not solder pads) be
a concern even after assembly?  Is whisker growth a function of the
environment or just time?  Could the tin in the immersion tin process be
alloyed (with a small percent of something else) to prevent whisker growth?

BTW, my interest is to get away from HASL.  It seems that two good
alternatives are immersion tin and OSP.  My applications are airborne
military and space, though.


Jim Marsico
Senior Engineer
Production Engineering
AIL/Electronics Systems Group
An EDO Company
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