Is the immersion tin process the same as electroless plating?  How would one
specify the IWT process on a board drawing?  Is there a Mil spec or industry
spec which can be referenced?
Jim Marsico
Senior Engineer
Production Engineering
AIL/Electronics Systems Group
An EDO Company
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        -----Original Message-----
        From:   <Rudy Sedlak> [SMTP:[log in to unmask]]
        Sent:   Thursday, February 08, 2001 9:08 AM
        To:     [log in to unmask]
        Subject:        Re: [TN] More about white tin (another question)

        Ken:

        IWT, aka, immersion Tin, can be applied to any Copper based
substrate.  The
        plating process depends on Copper as a basis, and actually dissolves
some
        Copper in the plating process.  IWT will always be more expensive
than
        electroplating, at least per pound of Tin Deposited, however the
relative
        cost per square foot depends on how much Tin you are electroplating.
        Generally, IWT is a relatively expensive process, but since so
little Tin is
        deposited, on such a small area on printed circuit boards, it
becomes a
        detail cost.

        Rudy Sedlak
        RD Chemical Company


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