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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 24 Jan 2001 20:29:34 -0500 |
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Jim,
Like Gregg Klawson we have never found conductive adhesive attachment to
solder coated devices to be electrically stable, but all of this work was
with cure temepatures in the 150-165°C range (ceramic-like substrates).
I can make myself believe that lower cure temperatures would be better by
getting away from the plastic range of the solder.
I know there are multiple adhesive manufactures out there selling materials
for these applications, but have not been called upon to use them.
Question back at you all - with the readily exposed silver, seemingly just
waiting to migrate, doesn't anyone worry about this? Is conformal coating
percieved as the 'fix' to migration??
I would seem that board flexure during subsequent processing, or use, would
be catastrophic for polymer attachments.
I would appreciate enlightenment by the forum.
Steven Creswick
CTS RF Integrated Modules
At 03:34 PM 1/23/01 -0500, you wrote:
>Hello, Technet...
>
>Here is an unusual situation. We have to assemble a surface mount assembly
>using silver epoxy. Some of the components will be solder coated. I know,
>don't bother asking... this is the way it has to be. The good thing is that
>this assembly is a prototype for bench-top laboratory use only. There is no
>harsh environment and needs to operate 1, maybe 2, years. The question is
>does anyone foresee any problems? What happens when one mixes toe two
>technologies?
>
>Thanks,
>Jim Marsico
>EDO Electronic Systems Group
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