Jim, Like Gregg Klawson we have never found conductive adhesive attachment to solder coated devices to be electrically stable, but all of this work was with cure temepatures in the 150-165°C range (ceramic-like substrates). I can make myself believe that lower cure temperatures would be better by getting away from the plastic range of the solder. I know there are multiple adhesive manufactures out there selling materials for these applications, but have not been called upon to use them. Question back at you all - with the readily exposed silver, seemingly just waiting to migrate, doesn't anyone worry about this? Is conformal coating percieved as the 'fix' to migration?? I would seem that board flexure during subsequent processing, or use, would be catastrophic for polymer attachments. I would appreciate enlightenment by the forum. Steven Creswick CTS RF Integrated Modules At 03:34 PM 1/23/01 -0500, you wrote: >Hello, Technet... > >Here is an unusual situation. We have to assemble a surface mount assembly >using silver epoxy. Some of the components will be solder coated. I know, >don't bother asking... this is the way it has to be. The good thing is that >this assembly is a prototype for bench-top laboratory use only. There is no >harsh environment and needs to operate 1, maybe 2, years. The question is >does anyone foresee any problems? What happens when one mixes toe two >technologies? > >Thanks, >Jim Marsico >EDO Electronic Systems Group >[log in to unmask] <mailto:[log in to unmask]> > >--------------------------------------------------------------------------- ------ >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 >--------------------------------------------------------------------------- ------ > > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------