TECHNET Archives

December 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"<Rudy Sedlak>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 26 Dec 2000 16:35:01 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
Give us some hints on your process.

How do you clean before resist application?
How are the panels handled after cleaning, and before resist application, or
are they handled at all?
Do these problems occur on smooth Copper foils too?

These rough resists, DT, RTF, etc, usually adhere to resist better than
smooth foils, but if they become soiled by handling, etc, the soils can, in
certain cases, be more difficult to remove, as they are better bonded, and
when this happens the resist bonds to the soil (not well) instead of to
Copper.

Rudy Sedlak

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2