Ryan,
Look at the papers presented at the IPC National Conference on Surface
Finishes and Solderability in Irvin, CA on September '98 or '99 (I can't
remember which year.  There were many papers on ISn and IAg.  The Lucent
Technologies paper on IAg listed all of the specifications and requirements
they tested.

Regards,

George
George M. Wenger DMTS
Bell Laboratories Princeton, Supply Network Solutions
Engineering Research Center FMA / AQA / RCA Lab
(609) 639-2769 (Office); 3210 (Lab); 2343 (Fax)
[log in to unmask]


-----Original Message-----
From: Ryan Grant [mailto:[log in to unmask]]
Sent: Wednesday, December 20, 2000 10:38 AM
To: [log in to unmask]
Subject: [TN] immersion silver and tin qual


        Hi All,

        I've just been given an open ticket to conduct a surface finish qual
for immersion silver and immersion tin.  Anybody have suggestions about what
aspect of the finish to test?

        The surface will be used at SMT, thru-hole, press fit, and ICT (test
points).  (No wirebonding or contacts).  Edge plating may be necessary for
certain designs that ground the board to the chassis by sliding the board
into fingered slots.

        We are looking for a replacement of immersion gold, but don't want
to deal with the assembly issues with HASL or OSP.

        What I would like most is maintaining solderability WITHOUT taking
special precautions.  (At least, no more than must be done with gold).

Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]

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