Ryan, Look at the papers presented at the IPC National Conference on Surface Finishes and Solderability in Irvin, CA on September '98 or '99 (I can't remember which year. There were many papers on ISn and IAg. The Lucent Technologies paper on IAg listed all of the specifications and requirements they tested. Regards, George George M. Wenger DMTS Bell Laboratories Princeton, Supply Network Solutions Engineering Research Center FMA / AQA / RCA Lab (609) 639-2769 (Office); 3210 (Lab); 2343 (Fax) [log in to unmask] -----Original Message----- From: Ryan Grant [mailto:[log in to unmask]] Sent: Wednesday, December 20, 2000 10:38 AM To: [log in to unmask] Subject: [TN] immersion silver and tin qual Hi All, I've just been given an open ticket to conduct a surface finish qual for immersion silver and immersion tin. Anybody have suggestions about what aspect of the finish to test? The surface will be used at SMT, thru-hole, press fit, and ICT (test points). (No wirebonding or contacts). Edge plating may be necessary for certain designs that ground the board to the chassis by sliding the board into fingered slots. We are looking for a replacement of immersion gold, but don't want to deal with the assembly issues with HASL or OSP. What I would like most is maintaining solderability WITHOUT taking special precautions. (At least, no more than must be done with gold). Thanks Ryan Grant Advanced Technology Engineer MCMS (208) 898-1145 [log in to unmask] ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------