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December 2000

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Subject:
From:
Alain Savard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 19 Dec 2000 12:37:26 -0500
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Hi all,

I haven't looked at plugging on one side for OSP before, but it doesn't
sound like a good idea. Plugged vias have a tendency to entrap chemicals
(from ANY of the subsequent process).  These chemicals can thereafter go
right through the OSP (which typically does not provide very good long term
corrosion protection at any rate) and corrode the material of the vias. For
OSP, I would definitely suggest plugging on both sides or not at all.

Just my 2 cents (that's 3 cents in Canadian money)!

Happy holidays,

Alain Savard, B.Sc.
Chemical Process Analyst
CAE Electronics Ltd.
e-mail: [log in to unmask]


-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: December 19, 2000 10:53 AM
To: [log in to unmask]
Subject: [TN] OSP PROCESS


 Season's Greetings to All
On boards with plugged vias (one side only) that have an OSP coating, does
the
OSP coating go on Before or After the solder mask plugging?

We have boards with corroded holes that I am told have the vias plugged,
then
the board goes through a dilute sulphuric acid microetch, followed by OSP.

Doesn't seem a like a real good idea to me!!

Susan Mansilla
Robisan Lab

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