Content-Type: |
text/plain |
Sender: |
|
Subject: |
|
From: |
|
Date: |
Wed, 1 Nov 2000 15:02:14 -0800 |
MIME-Version: |
1.0 |
X-To: |
|
Reply-To: |
|
Parts/Attachments: |
|
|
Check out this article...may be useful. No personal experience with it.
Glenn
"The case of the Missing Surface-Mount Pads," J. Ferry. Circuits Assembly,
June 2000.
htttp://www.circuitsassembly.com
> -----Original Message-----
> From: Ryu [SMTP:[log in to unmask]]
> Sent: Wednesday, November 01, 2000 8:20 AM
> To: [log in to unmask]
> Subject: [TN] Is it possible to repair BGA pad?
>
> During a reballing process, we accidentally removed a pad from the BGA
> substrate in the cleaning
> process. Is there any reliable method to attach the pad back to the
> substrate? or should we
> re-use the part at all. Thanks .
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|