Check out this article...may be useful.  No personal experience with it.

Glenn

"The case of the Missing Surface-Mount Pads," J. Ferry.  Circuits Assembly,
June 2000.

htttp://www.circuitsassembly.com

> -----Original Message-----
> From: Ryu [SMTP:[log in to unmask]]
> Sent: Wednesday, November 01, 2000 8:20 AM
> To:   [log in to unmask]
> Subject:      [TN] Is it possible to repair BGA pad?
>
> During a reballing process, we accidentally removed a pad from the BGA
> substrate in the cleaning
> process. Is there any reliable method to attach the pad back to the
> substrate?  or should we
> re-use the part at all.  Thanks .

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