We are having some discussion of the pros/cons of crosshatch vs. solid fill for copper ground planes on surface layers of multilayer boards. Perhaps someone can help me with some answers.
Is there a discernable difference in soldermask adhesion?
Does the extra copper detract from reflow or rework operations?
Is there a difference in board warp susceptibility?
Why would an electrical guy want one vs. the other?
> Larry Jindra
> TRW/Avionics Systems Division
> mailto:[log in to unmask] ph (858) 592-3424 fax (858) 592-3606
>
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