We are having some discussion of the pros/cons of crosshatch vs. solid fill for copper ground planes on surface layers of multilayer boards. Perhaps someone can help me with some answers. Is there a discernable difference in soldermask adhesion? Does the extra copper detract from reflow or rework operations? Is there a difference in board warp susceptibility? Why would an electrical guy want one vs. the other? > Larry Jindra > TRW/Avionics Systems Division > mailto:[log in to unmask] ph (858) 592-3424 fax (858) 592-3606 > --------------------------------------------------------------------------------- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------