We are having some discussion of the pros/cons of crosshatch vs. solid fill for copper ground planes on surface layers of multilayer boards.  Perhaps someone can help me with some answers.

Is there a discernable difference in soldermask adhesion?
Does the extra copper detract from reflow or rework operations?
Is there a difference in board warp susceptibility?
Why would an electrical guy want one vs. the other?


> Larry Jindra
> TRW/Avionics Systems Division
> mailto:[log in to unmask]   ph (858) 592-3424   fax (858) 592-3606
>

---------------------------------------------------------------------------------
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF TECHNET
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------