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Date: | Fri, 13 Oct 2000 12:35:59 EDT |
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In a message dated 10/13/2000 10:51:00 AM Central Daylight Time,
[log in to unmask] writes:
Hi Leo and Dave!
We have a few boards that we build that has both TO263's and TO220's on them.
When I get the stencils made that has these parts, I have my stencil vendor
split the big grounding pad up into 4-squares, kinda' looks like a window
pane.
I do that only reduce the size of the aperture, and to have some material to
support the squeegee during the print stroke as it passes over the big
aperture. I use metal squeegees and don't have to worry as much about
scoop-out, but even with metal squeegees, you still could get some scoop-out
with big area apertures...
-Steve Gregory-
> hi
>
> our production is questioning the size of the land for solder paste for a
> to263 5 lead part. they fear that there will be too much paste in that
area.
> the pad for the case is .410 x .425 and we specified the same size
clearance
> for the solder paste. their suggestion is to use two smaller rectangles
> instead of one large square surface.
>
> any suggestions or comments ?
> thank you
>
> Leo Flick or Dave Kissinger
> DRS Communications Company
> 1200 E. Mermaid Lane, Wyndmoor, PA 19038
> [log in to unmask] <mailto:[log in to unmask]>
> [log in to unmask] <mailto:[log in to unmask]
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