In a message dated 10/13/2000 10:51:00 AM Central Daylight Time, [log in to unmask] writes: Hi Leo and Dave! We have a few boards that we build that has both TO263's and TO220's on them. When I get the stencils made that has these parts, I have my stencil vendor split the big grounding pad up into 4-squares, kinda' looks like a window pane. I do that only reduce the size of the aperture, and to have some material to support the squeegee during the print stroke as it passes over the big aperture. I use metal squeegees and don't have to worry as much about scoop-out, but even with metal squeegees, you still could get some scoop-out with big area apertures... -Steve Gregory- > hi > > our production is questioning the size of the land for solder paste for a > to263 5 lead part. they fear that there will be too much paste in that area. > the pad for the case is .410 x .425 and we specified the same size clearance > for the solder paste. their suggestion is to use two smaller rectangles > instead of one large square surface. > > any suggestions or comments ? > thank you > > Leo Flick or Dave Kissinger > DRS Communications Company > 1200 E. Mermaid Lane, Wyndmoor, PA 19038 > [log in to unmask] <mailto:[log in to unmask]> > [log in to unmask] <mailto:[log in to unmask] --------------------------------------------------------------------------------- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------