It's a plastic BGA, with balldiameter between 0.45 and 0.50 mm. Padsize on the board is 13.8 mils, I will use a 5 mil thick stencil with 13.5 mil square apertures.
daan
>>> "Marsico, James" <[log in to unmask]> 10/10 2:33 pm >>>
Need more details like what is the solder ball diameter, ceramic or plastic
BGA, how much solder paste are you depositing?
Thanks,
Jim M.
-----Original Message-----
From: d. terstegge [SMTP:[log in to unmask]]
Sent: Tuesday, October 10, 2000 10:25 AM
To: [log in to unmask]
Subject: Re: [TN] Heavy BGA's, now it's fine-pitch !
Hi Jim,
Thanks for the suggestion. Any idea on how thick such a spacer
should be, and how to apply it ? Like I mentioned, trial and error is no
option for this project.
Kind regards,
Daan Terstegge
SMT Centre
Signaal Communications
Unclassified mail
Personal Website: http://www.smtinfo.net
>>> "Marsico, James" <[log in to unmask]> 10/10 2:08 pm >>>
How about using a temporary spacer under each corner?
Jim M.
-----Original Message-----
From: d. terstegge [SMTP:[log in to unmask]]
Sent: Tuesday, October 10, 2000 9:59 AM
To: [log in to unmask]
Subject: [TN] Heavy BGA's, now it's fine-pitch !
Hi Technet,
I need your advice on this one:
Some time ago there was a discussion about soldering
problems with
partnumberTMS320C6201GJC200 of Texas Instruments. It's a 1.27 mm
pich BGA
with a heavy heat-slug on top. The weight of the heat-slug makes the
solderballs collapse a little too much, resulting in solder bridges.
Now I've got to assemble some boards with similar parts, but
with a
much smaller ballpitch of only 0.8 mm.
No problem for the ordinary type BGA's, but with the
heatsink I'm
starting to feel uncomfortable. For the record: it's TI's part
numberTMX320C6203GLS.
I've got to build two boards, and all I've got is two
components. No
trial and error possible......
If anyone of you have experience or thoughts about this,
please let
me know.
Kind regards,
Daan Terstegge
SMT Centre
Signaal Communications
Unclassified mail
Personal Website: http://www.smtinfo.net
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