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October 2000

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Date:
Tue, 10 Oct 2000 16:35:08 +0100
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"TechNet E-Mail Forum." <[log in to unmask]>, "d. terstegge" <[log in to unmask]>
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It's a plastic BGA, with balldiameter between 0.45 and 0.50 mm. Padsize on the board is 13.8 mils, I will use a 5 mil thick stencil with 13.5 mil square apertures.

daan

>>> "Marsico, James" <[log in to unmask]> 10/10 2:33 pm >>>
Need more details like what is the solder ball diameter, ceramic or plastic
BGA, how much solder paste are you depositing?

Thanks,
Jim M.


        -----Original Message-----
        From:   d. terstegge [SMTP:[log in to unmask]] 
        Sent:   Tuesday, October 10, 2000 10:25 AM
        To:     [log in to unmask] 
        Subject:        Re: [TN] Heavy BGA's, now it's fine-pitch !

        Hi Jim,

        Thanks for the suggestion. Any idea on how thick such a spacer
should be, and how to apply it ?  Like I mentioned, trial and error is no
option for this project.

        Kind regards,

        Daan Terstegge
        SMT Centre
        Signaal Communications
        Unclassified mail
        Personal Website: http://www.smtinfo.net 

        >>> "Marsico, James" <[log in to unmask]> 10/10 2:08 pm >>>
        How about using a temporary spacer under each corner?

        Jim M.


                -----Original Message-----
                From:   d. terstegge [SMTP:[log in to unmask]] 
                Sent:   Tuesday, October 10, 2000 9:59 AM
                To:     [log in to unmask] 
                Subject:        [TN] Heavy BGA's, now it's fine-pitch !

                Hi Technet,

                I need your advice on this one:
                Some time ago there was a discussion about soldering
problems with
        partnumberTMS320C6201GJC200 of Texas Instruments. It's a 1.27 mm
pich BGA
        with a heavy heat-slug on top. The weight of the heat-slug makes the
        solderballs collapse a little too much, resulting in solder bridges.
                Now I've got to assemble some boards with similar parts, but
with a
        much smaller ballpitch of only 0.8 mm.
                No problem for the ordinary type BGA's, but with the
heatsink I'm
        starting to feel uncomfortable. For the record: it's TI's part
        numberTMX320C6203GLS.
                I've got to build two boards, and all I've got is two
components. No
        trial and error possible......
                If anyone of you have experience or thoughts about this,
please let
        me know.

                Kind regards,

                Daan Terstegge
                SMT Centre
                Signaal Communications
                Unclassified mail
                Personal Website: http://www.smtinfo.net 




	
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