I'm looking for some guidelines for pad layouts for TC3528 tanatalum caps
which are epoxied on the bottom side of a PCB and wave soldered.  On the
particular boards in question, the pads have been laid out approximately to
what the IPC Land Calculator comes up with for a B-size cap.  The top-side
parts that are pasted and reflowed are fine, but the bottom side parts have
intermittent skips that appear due to not enough pad extending beyond the
part for a fillet to form.  Are there any general guidelines I can pass on
to this customer regarding pad layout for these parts to be wave soldered?

On a related (sort of) subject, the IPC Land Calculator comes up with
different pad layouts for TC3528 package vs. B-size tantalum package.  I
always thought these were the same.  Am I misinformed?

Thanks in advance,

Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask]

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