Jim,
Thanks for the quick response. It is good in a way to know we are not the
only site to have seen a particular problem. Since this seems to be pretty
rare (At least I had never heard of it before) I presume it must be related
to the exact cooling behavior of the pot - size, shape, amount of solder,
temperature, amount of insulation, otherwise everyone would have seen it. We
have been covering the exit port of the machine, but in the last burp it
fell down through the machine, hit the floor and splashed out where a person
could have been standing. We will follow your lead and will now start to
cover the source - the pot itself. Thanks.
Bev
-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: Tuesday, September 26, 2000 2:16 PM
To: [log in to unmask]
Subject: Re: [TN] DENSE SMT ASSEMBLY
Yes, I'm afraid I am serious... The board is 5 thousandths of an inch thick
and is made of 6002 Rogers Duroid!
Thanks,
Jim M.
-----Original Message-----
From: Bev Christian [SMTP:[log in to unmask]]
Sent: Tuesday, September 26, 2000 1:55 PM
To: [log in to unmask]
Subject: Re: [TN] DENSE SMT ASSEMBLY
Jim,
Are you serious?! Did you really mean the board is 5 thou thick or
that the
Teflon coating on the board is 5 thou thick or did you mean a 50
thou thick
board?
Bev Christian
-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: Tuesday, September 26, 2000 1:11 PM
To: [log in to unmask]
Subject: [TN] DENSE SMT ASSEMBLY
Hello Technet:
Well, the Electrical Engineers did it to me again! They're
designing an
assembly consisting of a Teflon surface mount board .005" thick,
approximately 1.5 x 1.7", with 320 components! The component mix is
mostly
0402's (resistors, caps and inductors) and 30 SOT-363s. Does anyone
have
any suggestions as how to automate this assembly process?
Thanks in advance,
Jim Marsico
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