TECHNET Archives

August 2000

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Via problems
From:
"Lefebvre, Scott" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 8 Aug 2000 18:12:21 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
I have a problem with via's that have been masked over having trapped solder in the via's after HASL.  The solder that is in the via's is surfacing after we reflow the bottom side of the board.  I have not had this problem before and wanted some advice from all of you.

Thank you,

Scott Lefebvre
[log in to unmask]

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2