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August 2000

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Sender:
TechNet <[log in to unmask]>
Subject:
Via problems
From:
"Lefebvre, Scott" <[log in to unmask]>
Date:
Tue, 8 Aug 2000 18:12:21 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, "Lefebvre, Scott" <[log in to unmask]>
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I have a problem with via's that have been masked over having trapped solder in the via's after HASL.  The solder that is in the via's is surfacing after we reflow the bottom side of the board.  I have not had this problem before and wanted some advice from all of you.

Thank you,

Scott Lefebvre
[log in to unmask]

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