In a message dated 08/29/2000 2:54:27 PM Central Daylight Time,
[log in to unmask] writes:

> Stephen , After seeing that photo and reviewing the paste print picture it
>  looks like the vias under that side of the component are stealing the
solder
>  from that area under the part. Do you concur with that finding?
>  - Bill Brooks

Yep,

Sure do...sometimes we'll even see little solderballs that have come out
through the via's on the backside of the board.
Putting more paste down won't help in my opinion, it'll just flow through the
board and come out through the via's on the backside. I went to Anaren's web
page and the layout and footprint on this board is exactly what Anaren says
it should be. Go to:

http://www.anaren.com/pdfs/1d1304-03.pdf

They say the more via's the better to minimize ground inductance and improve
ground continuity...

-Steve Gregory-

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