Stephen , After seeing that photo and reviewing the paste print picture it
looks like the vias under that side of the component are stealing the solder
from that area under the part. Do you concur with that finding?
- Bill Brooks


-----Original Message-----
From: Stephen R. Gregory [mailto:[log in to unmask]]
Sent: Tuesday, August 29, 2000 12:33 PM
To: [log in to unmask]
Subject: Re: [TN] Castellated Hybrid soldering...Pic's are up


In a message dated 08/29/2000 1:16:08 PM Central Daylight Time,
[log in to unmask] writes:

> Well, I have seen some interesting problems before... I wonder if you
could
>  show us a component mounted to give us an idea of what the customer is
>  objecting to...
>  I have solved some of these problems using "solder dams", a thin line of
>  soldermask to prevent solder thieving from the close vias...
>  It would help though to see what the actual problem is... it's hard to
>  visualize.
>
>  Bill Brooks

Hi Bill!!

Picture is up, it's called Hybrid.jpg...go to:

http://www.driveway.com/share?sid=e25a88c4.8e904&name=Pictures

What is being objected to is that there is little, or no solder fillet where
I've indicated in the picture. The RF castellations are filleted, and there
is a teeny fillet in the ground castellation, but no filleting along the
horizontal edges on the ground pad.

The part is placed on top of solderpaste (you can see the paste print in the
other picture here), and the bottom of the component body is soldered
directly on the gounding pad. But with all the via's and the exposed copper
along the edges, there's not a snowballs chance I'll ever get decent fillets
where they say they want them.
I can hand add them for a price, but I don't think it should be
necessary...but hey, I'm not an RF guy...

-Steve Gregory-

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