Stephen

See p 141 ff of Manufacturing Techniques for Surface Mounted Assemblies
by Klein Wassink and Verguld (Electrochemical Publications). This gives
a detailed analysis of the problem. Essentially you need very long pads
on the shadow side of the component plus the judicious use of 'thief
pads' to guide the solder to where you need it and then to guide the
excess away.

Brian

Stephen Thornton wrote:

> To All Technetters,This question has probably been asked many times
> but I'll ask the experts one more timeCan anyone tell me how to get
> good solder perfomance when wave soldering SOT23 packagesWe have tried
> quite a few different things but cannot seem to get consistently good
> joints on a range of different boards and products.We have layed out
> the lans and pads to the IPC recommendations and tried going larger,
> smaller and different orientation etc with no major success.Has anyone
> out there got the key to this one?Any suggestions would be
> appreciated.Please reply to the forum so that all can share the
> wisdomThanks in advance Stephen Thornton
> Engineering Manager Tytronics
> 12 Circuit Drive Hendon SA 5014
> Telephone: +61 (0)8 8268 5400
> Fax: +61 (0)8 8268 2503

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