Stephen See p 141 ff of Manufacturing Techniques for Surface Mounted Assemblies by Klein Wassink and Verguld (Electrochemical Publications). This gives a detailed analysis of the problem. Essentially you need very long pads on the shadow side of the component plus the judicious use of 'thief pads' to guide the solder to where you need it and then to guide the excess away. Brian Stephen Thornton wrote: > To All Technetters,This question has probably been asked many times > but I'll ask the experts one more timeCan anyone tell me how to get > good solder perfomance when wave soldering SOT23 packagesWe have tried > quite a few different things but cannot seem to get consistently good > joints on a range of different boards and products.We have layed out > the lans and pads to the IPC recommendations and tried going larger, > smaller and different orientation etc with no major success.Has anyone > out there got the key to this one?Any suggestions would be > appreciated.Please reply to the forum so that all can share the > wisdomThanks in advance Stephen Thornton > Engineering Manager Tytronics > 12 Circuit Drive Hendon SA 5014 > Telephone: +61 (0)8 8268 5400 > Fax: +61 (0)8 8268 2503 ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################