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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 14 Jun 2000 09:08:15 EDT |
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Technetters,
We are currently using a diamond cross-hatching pattern for plating thieving
and are experiencing the following problems when using this on 3 - 5 oz
finished
panels.
- excessive entrapment / dragout of solutions (etchant,tin strip etc.)
- the height of the finished thieving also aggressively attacks
the composite brushes in our pre-mask scrubber.
Any ideas on what different configuration \ design for plating thieving on the
panel waste areas may act best in helping minimize these occurrences while
still acting as a good plating thief.
Thank You
Brett Austin
Nationwide Circuits, Inc
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