In a message dated 06/16/2000 9:21:57 AM Central Daylight Time,
[log in to unmask] writes:
<< Does anyone know where to locate a recommended land pattern for a SOT243-1
(ref: Phillips)
Thankyou >>
Hi Greg!
This package looks to me like a through-hole "ZIP DRAM" type of package...
Go to: http://www.phillips.semiconductors.com/package/SOT243-1
There's an outline drawing of the package there. It's a 17-pin device so you
would layout two rows of holes, 9 one row, 8 on the other row, 5.08mm between
the rows, with each hole on 2.54mm centers, and then position each row so
that the holes will zig-zag from each other. Like below:
O O O O O O O O O
O O O O O O O O
-Steve Gregory-
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