In a message dated 06/16/2000 9:21:57 AM Central Daylight Time, [log in to unmask] writes: << Does anyone know where to locate a recommended land pattern for a SOT243-1 (ref: Phillips) Thankyou >> Hi Greg! This package looks to me like a through-hole "ZIP DRAM" type of package... Go to: http://www.phillips.semiconductors.com/package/SOT243-1 There's an outline drawing of the package there. It's a 17-pin device so you would layout two rows of holes, 9 one row, 8 on the other row, 5.08mm between the rows, with each hole on 2.54mm centers, and then position each row so that the holes will zig-zag from each other. Like below: O O O O O O O O O O O O O O O O O -Steve Gregory- ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################