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June 2000

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Wed, 14 Jun 2000 09:08:15 EDT
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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Technetters,

We are currently using a diamond cross-hatching pattern for plating thieving
and are experiencing the following problems when using this on 3 - 5 oz
finished
panels.
     - excessive entrapment / dragout of solutions (etchant,tin strip etc.)
     - the height of the finished thieving also aggressively attacks
       the composite brushes in our pre-mask scrubber.

Any ideas on what different configuration \ design for plating thieving on the
panel waste areas  may act best in helping minimize these occurrences while
still acting as a good plating thief.

Thank You

Brett Austin
Nationwide Circuits, Inc
[log in to unmask]

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