Donn,

Generally speaking, check out IPC 7525 Stencil Design Guidelines, which has
just been released.  It discusses  three methods for the intrusive solder
process: overprint without step, overprint with step, and two print
stencil.  Each job needs to be evaluated on an individual basis--depending
on how the board is designed.
Ideal situation would be if the board has been specifically designed for
reflow, or if the lead size of the thru hole  components and the diameter
of the hole are close in size so that you could use the "overprint without
step".  I'm sure  there are tech-netters out there that can give you
specific information as to how they have done the design and the ultimate
result.

Kathy

At 01:26 PM 6/8/00 -0500, you wrote:
>TECHNET
>
>Does anybody have stencil/process design guidelines for implementing paste
>thru-hole technology?  We have a multipin connector we would like to reflow
>instead of solderwave.  Any comments or pointers would be greatly
>appreciated.
>
>Donn Steffen
>Wk# (219)925-8887
>Fax# (219)925-8710
>Email: [log in to unmask]
>
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