Donn, Generally speaking, check out IPC 7525 Stencil Design Guidelines, which has just been released. It discusses three methods for the intrusive solder process: overprint without step, overprint with step, and two print stencil. Each job needs to be evaluated on an individual basis--depending on how the board is designed. Ideal situation would be if the board has been specifically designed for reflow, or if the lead size of the thru hole components and the diameter of the hole are close in size so that you could use the "overprint without step". I'm sure there are tech-netters out there that can give you specific information as to how they have done the design and the ultimate result. Kathy At 01:26 PM 6/8/00 -0500, you wrote: >TECHNET > >Does anybody have stencil/process design guidelines for implementing paste >thru-hole technology? We have a multipin connector we would like to reflow >instead of solderwave. Any comments or pointers would be greatly >appreciated. > >Donn Steffen >Wk# (219)925-8887 >Fax# (219)925-8710 >Email: [log in to unmask] > >############################################################## >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >############################################################## >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in >the body: >To subscribe: SUBSCRIBE TECHNET <your full name> >To unsubscribe: SIGNOFF TECHNET >############################################################## >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information. >If you need assistance - contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 >############################################################## > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################