In a message dated 05/08/2000 11:50:47 AM US Eastern Standard Time,
[log in to unmask] writes:

>
>  Just one question... are OSP users concerned with dendrite growth?

All assemblers should be concerned about dendritic growth.  It doesn't matter
if it is tin-lead, copper-OSP, immersion silver, immersion tin, etc.

>
>  Isn't ENIG safer in regard of dendrite growth?

Dunno.  What's an ENIG?

Is it, by chance, a small heavy-set lowland bird which flies in ever
diminishing circles crying Wango, Wango?

Doug Pauls
On yet another Mountain Dew binge............

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