Good Morning TechNet,

I have a couple of questions on a couple of SMT parts.

The First part is an aluminum electrolytic chip cap(wet cap)(SMT D Case).
Does anyone know of any problems with these if used on the top side of the
board?

The Second part is a ceramic chip cap in a 1812 package. Again this part is
on the top side of the board. Is the size of the part and the thermal
coefficient difference great enough to cause solder joint cracking?

Thanks in advance to all you SMT component experts!

Ken Bloomquist

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