I agree with the wetting balance test.  You may have pads or components
that have oxidation, in turn needing a more active flux (high halide
content) to successfully wet.  There may also be some intermetallic growth
in your soldering area.

If you need some help with setting up your parameters for your wetting
balance or need help with the graphs, you can contact me direct or off
line.

Virgil Minor
[log in to unmask]
1-800-527-4549 x113

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