On a recent run of Ni/Ag boards (SM & PTH) we had solderability problems,
especially on the thru-hole components.  Upon investigation by the board
manufacturer,
it was reported as a black nickel barrier problem.  Apparently this is a
by-product of the immersion gold plating process.  What exactly is it, what
causes it, and is there a way
to prevent it?  Is there a way to "fix" a batch of boards with this problem?
Thank you.

Best Regards,

Mike Forrester
LeCroy Corp.

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