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May 2000

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Subject:
From:
Timothy Reeves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 May 2000 15:53:37 -0700
Content-Type:
text/plain
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text/plain (47 lines)
I believe the apparent contradiction results from IPC-SM-840 being a
_Soldermask_ Performance and Qualification Spec. not a board/assembly spec--
it doesn't apply directly to PWBs or PWAs.
   Just because you put on a mask that meets IPC-SM-840 doesn't mean your
board will meet IPC-6012, or the assembly will meet IPC-A-610, etc. You also
have to have proper surface prep, cure, etc.
Tim Reeves
ECD

> ----------
> From:         Tom Burek
> Sent:         Tuesday, May 23, 2000 12:55
> Subject:      Help! Interpret IPC-SM-840C and IPC-A-61
>
> Hello,
> Can one of you experts out there or perhaps someone from IPC interprets
> what appears to be a contradiction.
> IPC-SM-840C 3.5.2 Adhesion states that per table 2 a high reliability
> Rigid PCB that has a surface finish of Gold or Nickel can have a maximum
> 5% loss allowed on solder mask over a coupon per TM 2.4.28.1 of IPC-TM-650
> (Tape test).
> IPC-A-610 , 7.2 Coatings states a Non-conforming Defect- Class 1,2,3
> Degradation of the mask film that permits solder bridging or exposed basis
> metal.
>
> Can someone kindly differentiate the meanings?
>
> Thank You,
> Tom Burek
> Product Engineer
> [log in to unmask]
>

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