Did a brief inspection study.

Found out that depending upon the manufacturer's confidence level in the
process and experience with BGA's, inspections ranged from 100% for all
hardware, to 10% audit after component placement and after reflow soldering,
to 1st piece inspection after the process has been optimized. This also
depends on if production is low volume (where a sample of a batch may be
sufficient) or high volume (where it may be done on an hourly or shift
inspection rate). Some places may not use X-Ray inspection at all, and will
only do so if failures from electrical or functional test occur.

Another good source of information on BGA / Micro BGA inspection plans would
be the X-Ray vendors, such as Glenbrook
(http://www.glenbrooktech.com/4.html) and Nicolet (http://www.nicimg.com/).

Lee Whiteman
Senior Manufacturing Engineer
ACI / EMPF
Telephone: (610) 362-1200; Ext. 208
FAX: (610) 362-1290
E-Mail: [log in to unmask]




-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of Ralph Vaughan
Sent:   Wednesday, May 10, 2000 4:13 PM
To:     [log in to unmask]
Subject:        [TN] micro-bga

Question for micro-BGA Boys and girls:

I know it's good to x-ray inspect to ensure good attachment...if you
don't own some sort of inspection device, having it done for you is
probably not difficult.  Assuming you run a few boards, go down the
street for inspection, what is going on while the inspection is being
done?  Is the line on hold awaiting results?  Is the inspection done
each shift?   I know everybody's different; just trying to understand
acepted practice(s).

Thanks

Ralph Vaughan

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