Tom,
IPC 2221, 4.6, states "Liquid screened markings require clearances that are
typically 0.4 -0.5mm from solderable surfaces." This is the design standard
and also contains other marking guidelines and requirements.

IPC 6012, 3.3.5 states "Markings shall not cover areas of lands that are to
be soldered." This is the bare board acceptability standard.

IPC-A-600F allows on Classes 1 and 2 as acceptable "Marking ink on component
hole land does not extend into the part mounting hole or reduce minimum
annular ring." Hope this helps.

Mary Muller
ELDEC Corp.
Engineer
Materials and Processes

> ----------
> From:         Franklin D Asbell[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Franklin D Asbell
> Sent:         Thursday, May 25, 2000 9:07 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Searching for IPC "marking" spec
>
> IPC-A-600 F should have what you're looking for, although I don't
> beleive in that document there is criteria for that
>
>
> Franklin
>
>
>
> "Hybiske, Tom" wrote:
>
> >
> >
> >
> > Was wonder if anyone can point me to the IPC spec which specifically
> > states how close silk screen marking on a printed wiring board can be
> > to land areas?
> >
> > Thanks,
> > Tom Hybiske
> > General Atronics Corporation
> > Wyndmoor, PA
>
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