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Mon, 8 May 2000 15:47:59 EDT |
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In a message dated 05/08/2000 11:50:47 AM US Eastern Standard Time,
[log in to unmask] writes:
>
> Just one question... are OSP users concerned with dendrite growth?
All assemblers should be concerned about dendritic growth. It doesn't matter
if it is tin-lead, copper-OSP, immersion silver, immersion tin, etc.
>
> Isn't ENIG safer in regard of dendrite growth?
Dunno. What's an ENIG?
Is it, by chance, a small heavy-set lowland bird which flies in ever
diminishing circles crying Wango, Wango?
Doug Pauls
On yet another Mountain Dew binge............
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