I need a little help on a new design that Eng.in coming up with.  They
would like to take an Alumina substrate and attach a MMIC to it.  The
substrate is a MicroBGA.  We have a clean room operation in our facility
and do wire bonding but I do not have enough knowledge on how this would
be done.  Whether to solder it or use epoxy.  and it either then what
would the material be.  So if anyone can help with how the mmic should
be attached to the substrate or direct me to some good literature it
would be greatly appreciated.

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