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Subject:
Re: vapor phase reflow
From:
"Terveen, James @ NARDAEAST" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Mar 2000 16:00:47 -0500
Content-Type:
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text/plain (117 lines) 
Jason I agree with Ed.  We have used this process for many years with
very little problems on soldering ceramic substrate into RF housings.
The only issues that I know of and we have had them many times is the
availablity of the liquids and the expense of them.   You might be
better off with forced convection if you have any concerns with costs.

-----Original Message-----
From: Edward J. Valentine [mailto:[log in to unmask]]
Sent: Wednesday, March 01, 2000 3:34 PM
To: [log in to unmask]
Subject: Re: [TN] vapor phase reflow


Jason -

With all due respect to Mr. McMonagle, vapor phase reflow with
preheating
(an integral part of many units since the mid-80's), can produce
excellent
results in very dense assemblies and backplanes.  The chief advantage is
its
very even heat distribution over the assemble.  The highest temperature
fluorinated liquid that I am familiar with is FC-71, which has a higher
boiling temperature than the 215C (419F), FC-70.  The FC-71 is 250C
(495F).
The liquids are very expensive, but the only fluids that were/are
regulated
were the secondary fluids (Freons), not the Primary fluorinated fluids
since
they are not a HFC or cause any effect on the ozone, nor are they a
regulated contaminant,but that may vary at some locales.  Generally,
forced
convection is the preferred reflow process, but it is not a panacea for
all
applications.

If you would like to discuss some more, please feel free to contact me
offline.

Ed Valentine
Electronics Manufacturing Solutions
8612 Mourning Dove Road, Raleigh, NC 27615
Phone: (919) 270-5145, Fax: (919) 847-9971
Email: [log in to unmask]
Website: http://www.ems-consulting.com

----- Original Message -----
From: Jason Gregory <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, March 01, 2000 8:53 AM
Subject: [TN] vapor phase reflow


> Hello techies!
>
> I am looking for anyone who has performed any qualifications on the
advantages/disadvantages of vapor phase reflow. Particularly dealing
with
higher temp alloys. Is it the way to go? Is convection better? Who are
the
major manufacturers? Are silicon castments to keep the bottomside
components
from falling off mandatory? Any replies are GREATLY appreciated.
>
> Jason Gregory
> Production Manager
> Electrospec
> (713)784-4900
> (713)784-1194 fax
>
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