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March 2000

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Subject:
From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 31 Mar 2000 15:27:24 -0500
Content-Type:
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text/plain (66 lines)
Hi BLM,

you do not mention if the bridges you see are following reflow, or, most
likely wave soldering.

For wave, we found 10 mils to be a good distance to avoid shorts, so maybe
you should play a little with the soldering parameters.
Another solution, better, is to plug the vias from the side giving the
trouble.

I know this is not the answer you wanted, but I know nothing of specs on
this matter and I felt the need to comment, since the ol' boys are very
quiet lately.

Ioan

> -----Original Message-----
> From: Brad L. Matthies [SMTP:[log in to unmask]]
> Sent: Friday, March 31, 2000 1:27 PM
> To:   [log in to unmask]
> Subject:      [TN] Via Hole Placement.
>
> TN,
>
> We are experiencing some manufacturing problems (solder bridging) and
> have linked them to via hole placement.  The particular assembly we are
> manufacturing has multiple via holes that are within approximately 15
> Mils of SMT lands.  Does anyone have a resource that spells out safe
> distances of via holes to SMT lands that they can pass along?  We are
> getting ready to approach the design group for this product and are
> looking for a qualified resource of information that we can use as well
> as the design group.
>
> Thanks,
> BLM
>
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