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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 3 Mar 2000 15:26:33 -0800 |
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Technetters:
What is your opinion on tenting of vias with LPI soldermask? If a design
gives leaves the mask film open over vias, the mask will be UV-exposed,
though not to the degree of the mask on the surface, resulting in some mask
coverage of copper inside the vias, but not as durable/thick as that on the
surface. Some of it will remain, some may end up HASL'ed. What is the
reliability of the "in-between" surfaces that don't coat with solder, but
also don't appear to be covered with mask? The "old specs" used to allow
some "haloing" around pads where thermal cured mask tapered off and left a
coppery ring around the solder-coated pad. Is this the same thing, and is it
a concern?
Designers/end users: If your design allows the vias to be covered with mask,
but the vias don't fill with mask, what problems do you foresee?
Thanks for any and all replies.
G'day
Timothy Reeves
ECD Circuit Board Division
13626 South Freeman Road
Mulino, OR 97042
[log in to unmask]
(503) 829-9108 (800) 228-8198 FAX (503) 829-5482
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