Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 14 Mar 2000 10:27:55 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Technetters,
We are researching moving away from plugging our vias with solder
mask (problems and reliability issues) and plugging with solder thru
the wave solder process.
I have read all of the archives, and printed a major novels worth
(thanx for past info group, those archives are a wealth!!) bit one
item is still missing I hope you can respond with info on:
ASSY: Do you have problems with, or design guidelines that address,
the solder filled vias under components, or is this even an issue?
FAB: How do most of your customers address this?
Please, deluge me with your wisdoms, responses and help on this issue.
Thanx in advance group.
Jeff Hempton, Sr. SMD Mfg. Engineer
United Technology Electronic Controls
e-mail: [log in to unmask]
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
|
|
|