Hi Technetters, We are researching moving away from plugging our vias with solder mask (problems and reliability issues) and plugging with solder thru the wave solder process. I have read all of the archives, and printed a major novels worth (thanx for past info group, those archives are a wealth!!) bit one item is still missing I hope you can respond with info on: ASSY: Do you have problems with, or design guidelines that address, the solder filled vias under components, or is this even an issue? FAB: How do most of your customers address this? Please, deluge me with your wisdoms, responses and help on this issue. Thanx in advance group. Jeff Hempton, Sr. SMD Mfg. Engineer United Technology Electronic Controls e-mail: [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################