TECHNET Archives

February 2000

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Lead Free Conference
From:
Russell S Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 14 Feb 2000 12:10:40 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Dear All,

Amongst the many topics discussed , from the user perspective (OEM /
Assembler) , OSP's were not a viable finish in terms of lead free soldering
due to the por wetting and resultant copper halo that remains when using
OSP's. More active fluxes improved the issue but lead to problems with SIR.
The preferred route in terms of work so far appears to be with ENi Imm Au and
Immersion Tins.

RG

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2