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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 3 Feb 2000 18:06:22 +0200 |
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> ----------
> From: Bob Willis[SMTP:[log in to unmask]]
> Reply To: Leadfree Electronics Assembly E-Mail Forum.;Bob Willis
> Sent: ?éåí ùìéùé 01 ôáøåàø 2000? 16:44
> To: [log in to unmask]
> Subject: Re: [LF] Solderability test results obtained with lead-free
> alloy s
>
> We hope the next edition of the Lead Free CookBook CD ROM will have
> results of solderability trials on lead free alloys with different surface
> coatings. It should also contain video clips of wetting tests which have
> already been done as examples of the test only.
>
> As a side issue the boards used in the video filming were three years old
> OSP, gold over nickel and Silver using a standard test flux with very good
> results. During filming the only problem we had was a fly landing on one
> of the samples during test. This clip will not be on the Cookbook CD.
>
> If any one wants the Bob Willis Solderability Fly video, goes down a storm
> at technical seminars, breaks up the technical bits. The clip is only 500K
> for use on PowerPoint presentations and its FREEE
>
>
> Bob Willis
>
> Home Page: www.bobwillis.co.uk
> Tel: (44) 01245 351502
> Fax: (44) 01245 496123
>
> ----- Original Message -----
> From: Michel Leuchtmann
> To: [log in to unmask]
> Sent: Tuesday, February 01, 2000 1:47 PM
> Subject: Re: [LF] Solderability test results obtained with lead-free alloy
> s
>
>
> Hello,
>
> You will find, on the Multicore site,
>
> http://www.multicore.com/default.htm
>
> an interesting report on their lead free solder, paste and wire.
>
> By following the lead-free links, you will reach the report
> http://www.multicore.com/datasheets/msl733.pdf in which is detailed (page
> 2) the wetting time of their ECOSOL lead-free solder compared to the
> Sn60Pb40.
>
> A precedent Email in the IPC lead-free forum also gave this address:
>
> http://www.lead-free.org/
>
> which contains an interesting cross table alloys/suppliers (quite
> extensive). Some suppliers probably have reports as you look for
> (Multicore do).
>
> Regards.
>
> P.S.: I have no actions in Multicore.
>
> Michel Leuchtmann
> Design for Environment
>
> Tel: 33 01 39 44 56 23, ESN 579 56 23
> Fax: 33 01 39 44 50 16, ESN 579 50 16
>
> -----Message d'origine-----
> De: Walter Huck [SMTP:[log in to unmask]]
> Date: mardi 1 février 2000 13:59
> ?: [log in to unmask]
> Objet: [LF] Solderability test results obtained with lead-free alloys
>
> Dear colleagues,
> our German standardization committee has lauched a task force to study the
>
> influence of lead-free soldering processes to the content of existing
> standards,
> especially those describing test methods and evaluation critieria for
> solderability and resistance against soldering heat test.
>
> Previous investigations have shown that there will be differences in
> wetting
> behaviour compared to SnPb solder, which actually is used for these tests.
>
>
> Has anybody already done such investigations, or has information or
> links to
> reports etc. ?
>
> Walter Huck, Murata Electronic
>
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