> ---------- > From: Bob Willis[SMTP:[log in to unmask]] > Reply To: Leadfree Electronics Assembly E-Mail Forum.;Bob Willis > Sent: ?éåí ùìéùé 01 ôáøåàø 2000? 16:44 > To: [log in to unmask] > Subject: Re: [LF] Solderability test results obtained with lead-free > alloy s > > We hope the next edition of the Lead Free CookBook CD ROM will have > results of solderability trials on lead free alloys with different surface > coatings. It should also contain video clips of wetting tests which have > already been done as examples of the test only. > > As a side issue the boards used in the video filming were three years old > OSP, gold over nickel and Silver using a standard test flux with very good > results. During filming the only problem we had was a fly landing on one > of the samples during test. This clip will not be on the Cookbook CD. > > If any one wants the Bob Willis Solderability Fly video, goes down a storm > at technical seminars, breaks up the technical bits. The clip is only 500K > for use on PowerPoint presentations and its FREEE > > > Bob Willis > > Home Page: www.bobwillis.co.uk > Tel: (44) 01245 351502 > Fax: (44) 01245 496123 > > ----- Original Message ----- > From: Michel Leuchtmann > To: [log in to unmask] > Sent: Tuesday, February 01, 2000 1:47 PM > Subject: Re: [LF] Solderability test results obtained with lead-free alloy > s > > > Hello, > > You will find, on the Multicore site, > > http://www.multicore.com/default.htm > > an interesting report on their lead free solder, paste and wire. > > By following the lead-free links, you will reach the report > http://www.multicore.com/datasheets/msl733.pdf in which is detailed (page > 2) the wetting time of their ECOSOL lead-free solder compared to the > Sn60Pb40. > > A precedent Email in the IPC lead-free forum also gave this address: > > http://www.lead-free.org/ > > which contains an interesting cross table alloys/suppliers (quite > extensive). Some suppliers probably have reports as you look for > (Multicore do). > > Regards. > > P.S.: I have no actions in Multicore. > > Michel Leuchtmann > Design for Environment > > Tel: 33 01 39 44 56 23, ESN 579 56 23 > Fax: 33 01 39 44 50 16, ESN 579 50 16 > > -----Message d'origine----- > De: Walter Huck [SMTP:[log in to unmask]] > Date: mardi 1 février 2000 13:59 > ?: [log in to unmask] > Objet: [LF] Solderability test results obtained with lead-free alloys > > Dear colleagues, > our German standardization committee has lauched a task force to study the > > influence of lead-free soldering processes to the content of existing > standards, > especially those describing test methods and evaluation critieria for > solderability and resistance against soldering heat test. > > Previous investigations have shown that there will be differences in > wetting > behaviour compared to SnPb solder, which actually is used for these tests. > > > Has anybody already done such investigations, or has information or > links to > reports etc. ? > > Walter Huck, Murata Electronic > > ################################################################ > Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] > with following text in the body: > To subscribe: SUBSCRIBE Leadfree <your full name> > To unsubscribe: SIGNOFF Leadfree > ################################################################ > IPCWorks -October 25-28 featuring an International Summit on Lead-Free > Electronic > Assemblies. > Please visit IPC's Center for Lead-Free Electronics Assembly > ( http://www.leadfree.org ) for additional information. > For technical support contact Gayatri Sardeshpande [log in to unmask] or > 847-790-5365. > ################################################################ > > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################