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Thu, 24 Feb 2000 11:14:02 -0700 |
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Hello everyone!
Our company is currently considering setting up standard guidelines for
Polyimide Board Rework & Repair. I have checked the latest IPCs (7711 &
7721), but neither give a clear cut answer to my questions. I was wondering
if maybe some of you could let me know what procedures you are following or
recommend.
Primarily, we want to know if preheating or baking out a board prior to
rework is required. If so, what temperature and for how long? (This is a
component loaded board, so we cannot exceed 85C). How long is considered
too long out of "dry" storage before another bake-out is required to drive
off any moisture absorption? And lastly, does anyone have any diffusion
coefficient data for different types of Conformal Coating (i.e. Conathane
CE-1175)?
Any information would be greatly appreciated.
Thank you!
Shala Burdette
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