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February 2000

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From:
"Burdette, Shala" <[log in to unmask]>
Date:
Thu, 24 Feb 2000 11:14:02 -0700
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Burdette, Shala" <[log in to unmask]>
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Hello everyone!

Our company is currently considering setting up standard guidelines for
Polyimide Board Rework & Repair.  I have checked the latest IPCs (7711 &
7721), but neither give a clear cut answer to my questions.  I was wondering
if maybe some of you could let me know what procedures you are following or
recommend.

Primarily, we want to know if preheating or baking out a board prior to
rework is required.  If so, what temperature and for how long?  (This is a
component loaded board, so we cannot exceed 85C).  How long is considered
too long out of  "dry" storage before another bake-out is required to drive
off any moisture absorption?  And lastly, does anyone have any diffusion
coefficient data for different types of Conformal Coating (i.e. Conathane
CE-1175)?

Any information would be greatly appreciated.

Thank you!
Shala Burdette

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